CNC PEEK-GF30

PEEK-GF30 is an advanced 30% glass fiber-reinforced thermoplastic composite that combines the exceptional base properties of polyetheretherketone (PEEK) with enhanced mechanical strength and thermal stability. This high-performance engineering material is specifically formulated to withstand the most demanding operating environments across aerospace, medical, semiconductor, and automotive industries. Through precision CNC machining, manufacturers can leverage these superior material properties to produce complex, high-tolerance components that maintain structural integrity under extreme conditions.

The CNC machining process enables the production of components with tight geometrical tolerances that often cannot be achieved through injection molding, especially for low-volume production runs or prototypes. Unlike unfilled PEEK, the glass fiber reinforcement in PEEK-GF30 significantly improves stiffness, dimensional stability, and wear resistance, while reducing the coefficient of thermal expansion. This makes it particularly suitable for precision components that must maintain their shape and functionality across varying temperature ranges. With continuous service temperatures up to 250°C and exceptional chemical resistance, CNC-machined PEEK-GF30 components deliver long-term reliability in challenging applications where metal components might fail due to corrosion or thermal limitations .

KEY BENEFITS

CNC machining of PEEK-GF30 offers distinct advantages that make it superior to both conventional plastics and many metal alternatives in specific applications. The incorporation of 30% glass fiber reinforcement creates a composite material with enhanced properties that bridge the gap between engineering plastics and metals, while maintaining the processing flexibility of thermoplastics. These benefits make it an ideal choice for manufacturers seeking to optimize component performance, reduce maintenance requirements, and extend product lifespans in challenging operating environments.

*Table: Comparative Properties of PEEK-GF30 vs. Unfilled PEEK*

Property PEEK-GF30 Unfilled PEEK Improvement
Heat Deflection Temperature ≥250°C @1.8MPa ~160°C Significant increase
Tensile Strength ≥110 MPa ~100 MPa Moderate improvement
Stiffness (Tensile Modulus) ≥6 GPa ~3.5 GPa Substantial increase
Dimensional Stability Low thermal expansion (≤30×10⁻⁶/K) Higher expansion Improved stability
Wear Resistance Excellent Good Enhanced performance

Enhanced Thermal & Mechanical Performance

  • Superior Heat Resistance: PEEK-GF30 maintains its mechanical properties at elevated temperatures, with a heat deflection temperature of ≥250°C at 1.8MPa load, allowing it to perform reliably in high-temperature environments where most engineering plastics would soften or deform . This thermal stability enables continuous service at 250°C, with short-term exposure capability up to 300°C, making it suitable for applications near heat sources or in high-friction environments where heat generation is significant .

  • Exceptional Mechanical Strength: The glass fiber reinforcement significantly enhances the stiffness and load-bearing capability of the base PEEK polymer. With a tensile modulus ≥6 GPa and flexural strength ≥200 MPa, PEEK-GF30 provides the structural integrity required for mechanical components subject to sustained loads . This results in improved resistance to deformation under stress, better creep resistance compared to unfilled polymers, and the ability to maintain precise geometries in demanding applications.

Specialized Properties & Manufacturing Benefits

  • Outstanding Dimensional Stability: The low coefficient of thermal expansion (≤30×10⁻⁶/K from 0-150°C) combined with minimal moisture absorption (≤0.1% in 24 hours) ensures that CNC-machined components maintain their precision across varying environmental conditions . This exceptional stability eliminates the need for compensation designs that might otherwise be required with more conventional materials, making it ideal for precision instruments and measurement devices.

  • Excellent Wear & Chemical Resistance: PEEK-GF30 offers superior performance in abrasive environments, with enhanced resistance to friction and wear compared to unfilled PEEK . Additionally, it maintains excellent chemical resistance against a wide range of hydrocarbons, acids, and bases, ensuring long-term functionality in chemically challenging applications such as chemical processing equipment and oil and gas components.

APPLICATIONS

The unique combination of properties offered by PEEK-GF30 makes it suitable for a diverse range of demanding applications across multiple industries. CNC machining enables the production of high-precision, custom components that leverage the material’s superior performance characteristics to solve specific engineering challenges. From semiconductor manufacturing to medical implants, PEEK-GF30 provides reliable solutions where conventional materials would fail under extreme operating conditions involving high temperatures, corrosive environments, or continuous mechanical stress.

*Table: PEEK-GF30 Applications Across Industries*

Industry Sector Specific Applications Key Property Utilized
Semiconductor & Electronics Semiconductor manufacturing apparatus, wafer carriers, insulation components, vacuum chambers High purity, low outgassing, thermal stability, electrostatic discharge (ESD) safety
Mechanical Engineering Precision bearings, gears, pumps, seals, bushings, fasteners, structural components High strength-to-weight ratio, wear resistance, low friction, dimensional stability
Medical Technology Surgical instruments, implantable devices, dental components, trauma fixation devices Biocompatibility, sterilization resistance, MRI compatibility, mechanical strength
Automotive & Aerospace Transmission components, brake system parts, engine covers, sensor housings Light weight, thermal stability, chemical resistance, vibration damping
Chemical Processing Pump components, valve seats, compressor plates, seal rings Corrosion resistance, low moisture absorption, thermal stability

High-Temperature Bearing & Sealing Applications

In mechanical engineering applications, PEEK-GF30 is specified for precision bearings and seals that must operate at elevated temperatures or in corrosive environments where traditional lubricants would degrade. The material’s inherent lubricity combined with its high temperature capability allows for the design of maintenance-free bearing systems that continue to perform when conventional petroleum-based lubricants would break down. Similarly, the material’s resistance to compression creep ensures that seals maintain their contact pressure and sealing capability throughout their service life, even under fluctuating thermal conditions .

Semiconductor & Medical Components

The semiconductor industry utilizes CNC-machined PEEK-GF30 for critical process components such as wafer carriers, plasma etch fixtures, and chemical processing chambers where minimal particulate generation, high purity, and thermal stability are essential. In medical applications, the material’s biocompatibility, radiolucency, and ability to withstand repeated sterilization cycles make it ideal for surgical instruments and implantable devices . The CNC machining process enables the production of highly complex, patient-specific medical components with the stringent dimensional accuracy required for proper fit and function.

TECHNICAL SPECIFICATIONS

The comprehensive technical specifications of PEEK-GF30 provide engineers and designers with the critical data needed for material selection and component design. These empirically tested properties represent minimum values under standardized testing conditions, offering reliable benchmarks for engineering calculations and performance predictions. The following data compilation represents typical values for 30% glass fiber-reinforced PEEK materials from manufacturer specifications and industry standards.

*Table: Comprehensive Technical Specifications of PEEK-GF30*

Property Test Standard Unit Value Conditions/Notes
Density ISO 1183-1 g/cm³ 1.51-1.55
Tensile Strength ISO 527-2 MPa ≥105-110 Yield strength
Tensile Modulus ISO 527-2 GPa ≥6 Stiffness measurement
Flexural Strength ISO 178 MPa ≥200-205
Flexural Modulus ISO 178 GPa ≥6.5-7
Elongation at Break ISO 527-2 % ≥8
Impact Strength (Notched) ISO 179 kJ/m² ≥4.0-5.0 Charpy method
Rockwell Hardness ISO 2039-2 HRM ≥100
Heat Deflection Temperature ISO 75-2 °C ≥250 @1.8MPa
Continuous Use Temperature UL 746B °C 250 Long-term
Thermal Conductivity ISO 8302 W/(m·K) 0.35
Coefficient of Thermal Expansion ISO 11359-2 10⁻⁶/K ≤30 0-150°C range
Water Absorption ISO 62 % ≤0.1 24 hours @23°C
Flame Resistance UL 94 V-0 Self-extinguishing
Volume Resistivity IEC 61340-2-3 Ω·cm 10¹⁴-10¹⁶ Excellent insulator

Thermal & Electrical Properties

The thermal properties of PEEK-GF30 make it particularly suitable for applications requiring stability across temperature extremes. With a heat deflection temperature of ≥250°C at 1.8MPa, the material maintains its structural integrity under mechanical load at elevated temperatures where most engineering plastics would deform . The low thermal conductivity (0.35 W/m·K) provides inherent thermal insulation, while the minimal linear thermal expansion coefficient (≤30×10⁻⁶/K between 0-150°C) ensures dimensional stability across operating temperature ranges. Electrically, PEEK-GF30 serves as an excellent insulator with volume resistivity ranging between 10¹⁴-10¹⁶ Ω·cm, making it suitable for high-temperature electrical applications .

Mechanical & Physical Characteristics

The mechanical property profile of PEEK-GF30 demonstrates its capability for structural applications requiring high stiffness and strength. With a tensile modulus ≥6 GPa and flexural strength ≥200 MPa, the material provides sufficient rigidity for load-bearing components . The Rockwell hardness of ≥100 HRM and notched impact strength of ≥4.0-5.0 kJ/m² reflect the material’s balance between surface durability and toughness. Physically, the density of 1.51-1.55 g/cm³ makes PEEK-GF30 approximately 40-50% lighter than aluminum, offering significant weight reduction opportunities in applications where mass is a critical design factor

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